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test7.xml
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<?xml version="1.0"?>
<!--
This example explains how a single real cooling device can be divided
into logical cooling devices with different minimum and maximum states.
In this case three trips are associated with three logical cooling
devices with same path but different minimum and maximum.
-->
<ThermalConfiguration>
<Platform>
<Name>THD_TEST_0</Name>
<ProductName>*</ProductName>
<Preference>QUIET</Preference>
<ThermalZones>
<ThermalZone>
<Type>thd_test_ex_0</Type>
<TripPoints>
<TripPoint>
<SensorType>thd_test_0</SensorType>
<Temperature>40000</Temperature>
<type>passive</type>
<CoolingDevice>
<Type>thd_cdev_0_cap_3</Type>
</CoolingDevice>
</TripPoint>
<TripPoint>
<SensorType>thd_test_0</SensorType>
<Temperature>50000</Temperature>
<type>passive</type>
<CoolingDevice>
<Type>thd_cdev_0_cap_6</Type>
</CoolingDevice>
</TripPoint>
<TripPoint>
<SensorType>thd_test_0</SensorType>
<Temperature>60000</Temperature>
<type>passive</type>
<CoolingDevice>
<Type>thd_cdev_0_cap_9</Type>
</CoolingDevice>
</TripPoint>
</TripPoints>
</ThermalZone>
</ThermalZones>
<CoolingDevices>
<CoolingDevice>
<Path>/sys/class/thermal/cooling_device7/cur_state</Path>
<Type>thd_cdev_0_cap_3</Type>
<MinState>0</MinState>
<IncDecStep>1</IncDecStep>
<MaxState>3</MaxState>
</CoolingDevice>
<CoolingDevice>
<Path>/sys/class/thermal/cooling_device7/cur_state</Path>
<Type>thd_cdev_0_cap_6</Type>
<MinState>4</MinState>
<IncDecStep>1</IncDecStep>
<MaxState>6</MaxState>
</CoolingDevice>
<CoolingDevice>
<Path>/sys/class/thermal/cooling_device7/cur_state</Path>
<Type>thd_cdev_0_cap_9</Type>
<MinState>9</MinState>
<IncDecStep>1</IncDecStep>
<MaxState>10</MaxState>
</CoolingDevice>
</CoolingDevices>
</Platform>
</ThermalConfiguration>