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Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/…
…rzhang/linux Pull thermal managament updates from Zhang Rui: - Enhance thermal "userspace" governor to export the reason when a thermal event is triggered and delivered to user space. From Srinivas Pandruvada - Introduce a single TSENS thermal driver for the different versions of the TSENS IP that exist, on different qcom msm/apq SoCs'. Support for msm8916, msm8960, msm8974 and msm8996 families is also added. From Rajendra Nayak - Introduce hardware-tracked trip points support to the device tree thermal sensor framework. The framework supports an arbitrary number of trip points. Whenever the current temperature is changed, the trip points immediately below and above the current temperature are found, driver callback is invoked to program the hardware to get notified when either of the two trip points are triggered. Hardware-tracked trip points support for rockchip thermal driver is also added at the same time. From Sascha Hauer, Caesar Wang - Introduce a new thermal driver, which enables TMU (Thermal Monitor Unit) on QorIQ platform. From Jia Hongtao - Introduce a new thermal driver for Maxim MAX77620. From Laxman Dewangan - Introduce a new thermal driver for Intel platforms using WhiskeyCove PMIC. From Bin Gao - Add mt2701 chip support to MTK thermal driver. From Dawei Chien - Enhance Tegra thermal driver to enable soctherm node and set "critical", "hot" trips, for Tegra124, Tegra132, Tegra210. From Wei Ni - Add resume support for tango thermal driver. From Marc Gonzalez - several small fixes and improvements for rockchip, qcom, imx, rcar, mtk thermal drivers and thermal core code. From Caesar Wang, Keerthy, Rocky Hao, Wei Yongjun, Peter Robinson, Bui Duc Phuc, Axel Lin, Hugh Kang * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (48 commits) thermal: int3403: Process trip change notification thermal: int340x: New Interface to read trip and notify thermal: user_space gov: Add additional information in uevent thermal: Enhance thermal_zone_device_update for events arm64: tegra: set hot trips for Tegra210 arm64: tegra: set critical trips for Tegra210 arm64: tegra: add soctherm node for Tegra210 arm64: tegra: set hot trips for Tegra132 arm64: tegra: set critical trips for Tegra132 arm64: tegra: use tegra132-soctherm for Tegra132 arm: tegra: set hot trips for Tegra124 arm: tegra: set critical trips for Tegra124 thermal: tegra: add hw-throttle for Tegra132 thermal: tegra: add hw-throttle function of: Add bindings of hw throttle for Tegra soctherm thermal: mtk_thermal: Check return value of devm_thermal_zone_of_sensor_register thermal: Add Mediatek thermal driver for mt2701. dt-bindings: thermal: Add binding document for Mediatek thermal controller thermal: max77620: Add thermal driver for reporting junction temp thermal: max77620: Add DT binding doc for thermal driver ...
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Documentation/devicetree/bindings/thermal/max77620_thermal.txt
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Thermal driver for MAX77620 Power management IC from Maxim Semiconductor. | ||
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Maxim Semiconductor MAX77620 supports alarm interrupts when its | ||
die temperature crosses 120C and 140C. These threshold temperatures | ||
are not configurable. Device does not provide the real temperature | ||
of die other than just indicating whether temperature is above or | ||
below threshold level. | ||
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Required properties: | ||
------------------- | ||
#thermal-sensor-cells: Please refer <devicetree/bindings/thermal/thermal.txt> | ||
for more details. | ||
The value must be 0. | ||
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For more details, please refer generic thermal DT binding document | ||
<devicetree/bindings/thermal/thermal.txt>. | ||
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Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding | ||
document for the MAX77620. | ||
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Example: | ||
-------- | ||
#include <dt-bindings/mfd/max77620.h> | ||
#include <dt-bindings/thermal/thermal.h> | ||
... | ||
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i2c@7000d000 { | ||
spmic: max77620@3c { | ||
compatible = "maxim,max77620"; | ||
::::: | ||
#thermal-sensor-cells = <0>; | ||
::: | ||
}; | ||
}; | ||
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cool_dev: cool-dev { | ||
compatible = "cooling-dev"; | ||
#cooling-cells = <2>; | ||
}; | ||
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thermal-zones { | ||
PMIC-Die { | ||
polling-delay = <0>; | ||
polling-delay-passive = <0>; | ||
thermal-sensors = <&spmic>; | ||
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trips { | ||
pmic_die_warn_temp_thresh: hot-die { | ||
temperature = <120000>; | ||
type = "hot"; | ||
hysteresis = <0>; | ||
}; | ||
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pmic_die_cirt_temp_thresh: cirtical-die { | ||
temperature = <140000>; | ||
type = "critical"; | ||
hysteresis = <0>; | ||
}; | ||
}; | ||
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cooling-maps { | ||
map0 { | ||
trip = <&pmic_die_warn_temp_thresh>; | ||
cooling-device = <&cool_dev THERMAL_NO_LIMIT | ||
THERMAL_NO_LIMIT>; | ||
contribution = <100>; | ||
}; | ||
}; | ||
}; | ||
}; |
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* QCOM SoC Temperature Sensor (TSENS) | ||
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Required properties: | ||
- compatible : | ||
- "qcom,msm8916-tsens" : For 8916 Family of SoCs | ||
- "qcom,msm8974-tsens" : For 8974 Family of SoCs | ||
- "qcom,msm8996-tsens" : For 8996 Family of SoCs | ||
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- reg: Address range of the thermal registers | ||
- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description. | ||
- Refer to Documentation/devicetree/bindings/nvmem/nvmem.txt to know how to specify | ||
nvmem cells | ||
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Example: | ||
tsens: thermal-sensor@900000 { | ||
compatible = "qcom,msm8916-tsens"; | ||
reg = <0x4a8000 0x2000>; | ||
nvmem-cells = <&tsens_caldata>, <&tsens_calsel>; | ||
nvmem-cell-names = "caldata", "calsel"; | ||
#thermal-sensor-cells = <1>; | ||
}; |
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