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yet other headers
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Pasquale Davide Schiavone committed Jul 27, 2017
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23 changes: 14 additions & 9 deletions sw/libs/bench_lib/inc/bench.h
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// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

#ifndef BENCH_H
#define BENCH_H
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24 changes: 14 additions & 10 deletions sw/libs/bench_lib/src/bench.c
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// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
#include "bench.h"
#include "uart.h"
#include "gpio.h"
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15 changes: 15 additions & 0 deletions sw/libs/math_fns_lib/inc/math_fns.h
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/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

/*----------------------------------------------------------------------------
| special FP math functions for ETHZ openrisc cores with FPU or LNU.
| Michael Gautschi, Michael Schaffner 2015
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15 changes: 15 additions & 0 deletions sw/libs/math_fns_lib/src/math_fns.c
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/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

/*----------------------------------------------------------------------------
| special FP math functions for ETHZ openrisc cores with FPU or LNU.
| Michael Gautschi, Michael Schaffner 2015
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23 changes: 14 additions & 9 deletions sw/libs/string_lib/inc/string_lib.h
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// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

#ifndef STRING_LIB_H
#define STRING_LIB_H
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23 changes: 14 additions & 9 deletions sw/libs/string_lib/src/qprintf.c
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// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

#include "string_lib.h"
#include "utils.h"
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23 changes: 14 additions & 9 deletions sw/libs/sys_lib/inc/bar.h
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@@ -1,12 +1,17 @@
// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

#ifndef __BAR_H__
#define __BAR_H__
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23 changes: 14 additions & 9 deletions sw/libs/sys_lib/inc/cpu_hal.h
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// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

#ifndef __OR10N_CPU_HAL_H__
#define __OR10N_CPU_HAL_H__
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23 changes: 14 additions & 9 deletions sw/libs/sys_lib/inc/event.h
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@@ -1,12 +1,17 @@
// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

/**
* @file
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23 changes: 14 additions & 9 deletions sw/libs/sys_lib/inc/gpio.h
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@@ -1,12 +1,17 @@
// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

/**
* @file
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23 changes: 14 additions & 9 deletions sw/libs/sys_lib/inc/i2c.h
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@@ -1,12 +1,17 @@
// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

/**
* @file
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24 changes: 14 additions & 10 deletions sw/libs/sys_lib/inc/int.h
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@@ -1,13 +1,17 @@
// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.

/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/
/**
* @file
* @brief Interrupt library for PULPino.
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23 changes: 14 additions & 9 deletions sw/libs/sys_lib/inc/pulpino.h
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@@ -1,12 +1,17 @@
// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

/**
* @file
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23 changes: 14 additions & 9 deletions sw/libs/sys_lib/inc/spi.h
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@@ -1,12 +1,17 @@
// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

/**
* @file
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23 changes: 14 additions & 9 deletions sw/libs/sys_lib/inc/timer.h
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@@ -1,12 +1,17 @@
// Copyright 2016 ETH Zurich and University of Bologna.
// Copyright and related rights are licensed under the Solderpad Hardware
// License, Version 0.51 (the “License”); you may not use this file except in
// compliance with the License. You may obtain a copy of the License at
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law
// or agreed to in writing, software, hardware and materials distributed under
// this License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR
// CONDITIONS OF ANY KIND, either express or implied. See the License for the
// specific language governing permissions and limitations under the License.
/* Copyright (C) 2017 ETH Zurich, University of Bologna
* All rights reserved.
*
* This code is under development and not yet released to the public.
* Until it is released, the code is under the copyright of ETH Zurich and
* the University of Bologna, and may contain confidential and/or unpublished
* work. Any reuse/redistribution is strictly forbidden without written
* permission from ETH Zurich.
*
* Bug fixes and contributions will eventually be released under the
* SolderPad open hardware license in the context of the PULP platform
* (http://www.pulp-platform.org), under the copyright of ETH Zurich and the
* University of Bologna.
*/

/**
* @file
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