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The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <[email protected]> Signed-off-by: Thomas Sujith <[email protected]> Signed-off-by: Len Brown <[email protected]>
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Generic Thermal Sysfs driver How To | ||
========================= | ||
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Written by Sujith Thomas <[email protected]>, Zhang Rui <[email protected]> | ||
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Updated: 2 January 2008 | ||
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Copyright (c) 2008 Intel Corporation | ||
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0. Introduction | ||
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The generic thermal sysfs provides a set of interfaces for thermal zone devices (sensors) | ||
and thermal cooling devices (fan, processor...) to register with the thermal management | ||
solution and to be a part of it. | ||
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This how-to focusses on enabling new thermal zone and cooling devices to participate | ||
in thermal management. | ||
This solution is platform independent and any type of thermal zone devices and | ||
cooling devices should be able to make use of the infrastructure. | ||
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The main task of the thermal sysfs driver is to expose thermal zone attributes as well | ||
as cooling device attributes to the user space. | ||
An intelligent thermal management application can make decisions based on inputs | ||
from thermal zone attributes (the current temperature and trip point temperature) | ||
and throttle appropriate devices. | ||
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[0-*] denotes any positive number starting from 0 | ||
[1-*] denotes any positive number starting from 1 | ||
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1. thermal sysfs driver interface functions | ||
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1.1 thermal zone device interface | ||
1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name, int trips, | ||
void *devdata, struct thermal_zone_device_ops *ops) | ||
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This interface function adds a new thermal zone device (sensor) to | ||
/sys/class/thermal folder as thermal_zone[0-*]. | ||
It tries to bind all the thermal cooling devices registered at the same time. | ||
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name: the thermal zone name. | ||
trips: the total number of trip points this thermal zone supports. | ||
devdata: device private data | ||
ops: thermal zone device callbacks. | ||
.bind: bind the thermal zone device with a thermal cooling device. | ||
.unbind: unbing the thermal zone device with a thermal cooling device. | ||
.get_temp: get the current temperature of the thermal zone. | ||
.get_mode: get the current mode (user/kernel) of the thermal zone. | ||
"kernel" means thermal management is done in kernel. | ||
"user" will prevent kernel thermal driver actions upon trip points | ||
so that user applications can take charge of thermal management. | ||
.set_mode: set the mode (user/kernel) of the thermal zone. | ||
.get_trip_type: get the type of certain trip point. | ||
.get_trip_temp: get the temperature above which the certain trip point | ||
will be fired. | ||
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1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz) | ||
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This interface function removes the thermal zone device. | ||
It deletes the corresponding entry form /sys/class/thermal folder and unbind all | ||
the thermal cooling devices it uses. | ||
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1.2 thermal cooling device interface | ||
1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name, | ||
void *devdata, struct thermal_cooling_device_ops *) | ||
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This interface function adds a new thermal cooling device (fan/processor/...) to | ||
/sys/class/thermal/ folder as cooling_device[0-*]. | ||
It tries to bind itself to all the thermal zone devices register at the same time. | ||
name: the cooling device name. | ||
devdata: device private data. | ||
ops: thermal cooling devices callbacks. | ||
.get_max_state: get the Maximum throttle state of the cooling device. | ||
.get_cur_state: get the Current throttle state of the cooling device. | ||
.set_cur_state: set the Current throttle state of the cooling device. | ||
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1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev) | ||
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This interface function remove the thermal cooling device. | ||
It deletes the corresponding entry form /sys/class/thermal folder and unbind | ||
itself from all the thermal zone devices using it. | ||
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1.3 interface for binding a thermal zone device with a thermal cooling device | ||
1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, | ||
int trip, struct thermal_cooling_device *cdev); | ||
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This interface function bind a thermal cooling device to the certain trip point | ||
of a thermal zone device. | ||
This function is usually called in the thermal zone device .bind callback. | ||
tz: the thermal zone device | ||
cdev: thermal cooling device | ||
trip: indicates which trip point the cooling devices is associated with | ||
in this thermal zone. | ||
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1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, | ||
int trip, struct thermal_cooling_device *cdev); | ||
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This interface function unbind a thermal cooling device from the certain trip point | ||
of a thermal zone device. | ||
This function is usually called in the thermal zone device .unbind callback. | ||
tz: the thermal zone device | ||
cdev: thermal cooling device | ||
trip: indicates which trip point the cooling devices is associated with | ||
in this thermal zone. | ||
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2. sysfs attributes structure | ||
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RO read only value | ||
RW read/write value | ||
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All thermal sysfs attributes will be represented under /sys/class/thermal | ||
/sys/class/thermal/ | ||
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Thermal zone device sys I/F, created once it's registered: | ||
|thermal_zone[0-*]: | ||
|-----type: Type of the thermal zone | ||
|-----temp: Current temperature | ||
|-----mode: Working mode of the thermal zone | ||
|-----trip_point_[0-*]_temp: Trip point temperature | ||
|-----trip_point_[0-*]_type: Trip point type | ||
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Thermal cooling device sys I/F, created once it's registered: | ||
|cooling_device[0-*]: | ||
|-----type : Type of the cooling device(processor/fan/...) | ||
|-----max_state: Maximum cooling state of the cooling device | ||
|-----cur_state: Current cooling state of the cooling device | ||
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These two dynamic attributes are created/removed in pairs. | ||
They represent the relationship between a thermal zone and its associated cooling device. | ||
They are created/removed for each | ||
thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device successful exection. | ||
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|thermal_zone[0-*] | ||
|-----cdev[0-*]: The [0-*]th cooling device in the current thermal zone | ||
|-----cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with | ||
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*************************** | ||
* Thermal zone attributes * | ||
*************************** | ||
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type Strings which represent the thermal zone type. | ||
This is given by thermal zone driver as part of registration. | ||
Eg: "ACPI thermal zone" indicates it's a ACPI thermal device | ||
RO | ||
Optional | ||
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temp Current temperature as reported by thermal zone (sensor) | ||
Unit: degree celsius | ||
RO | ||
Required | ||
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mode One of the predifned values in [kernel, user] | ||
This file gives information about the algorithm | ||
that is currently managing the thermal zone. | ||
It can be either default kernel based algorithm | ||
or user space application. | ||
RW | ||
Optional | ||
kernel = Thermal management in kernel thermal zone driver. | ||
user = Preventing kernel thermal zone driver actions upon | ||
trip points so that user application can take full | ||
charge of the thermal management. | ||
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trip_point_[0-*]_temp The temperature above which trip point will be fired | ||
Unit: degree celsius | ||
RO | ||
Optional | ||
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trip_point_[0-*]_type Strings which indicate the type of the trip point | ||
Eg. it can be one of critical, hot, passive, | ||
active[0-*] for ACPI thermal zone. | ||
RO | ||
Optional | ||
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cdev[0-*] Sysfs link to the thermal cooling device node where the sys I/F | ||
for cooling device throttling control represents. | ||
RO | ||
Optional | ||
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cdev[0-*]_trip_point The trip point with which cdev[0-*] is assocated in this thermal zone | ||
-1 means the cooling device is not associated with any trip point. | ||
RO | ||
Optional | ||
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****************************** | ||
* Cooling device attributes * | ||
****************************** | ||
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type String which represents the type of device | ||
eg: For generic ACPI: this should be "Fan", | ||
"Processor" or "LCD" | ||
eg. For memory controller device on intel_menlow platform: | ||
this should be "Memory controller" | ||
RO | ||
Optional | ||
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max_state The maximum permissible cooling state of this cooling device. | ||
RO | ||
Required | ||
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cur_state The current cooling state of this cooling device. | ||
the value can any integer numbers between 0 and max_state, | ||
cur_state == 0 means no cooling | ||
cur_state == max_state means the maximum cooling. | ||
RW | ||
Required | ||
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3. A simple implementation | ||
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ACPI thermal zone may support multiple trip points like critical/hot/passive/active. | ||
If an ACPI thermal zone supports critical, passive, active[0] and active[1] at the same time, | ||
it may register itself as a thermale_zone_device (thermal_zone1) with 4 trip points in all. | ||
It has one processor and one fan, which are both registered as thermal_cooling_device. | ||
If the processor is listed in _PSL method, and the fan is listed in _AL0 method, | ||
the sys I/F structure will be built like this: | ||
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/sys/class/thermal: | ||
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|thermal_zone1: | ||
|-----type: ACPI thermal zone | ||
|-----temp: 37 | ||
|-----mode: kernel | ||
|-----trip_point_0_temp: 100 | ||
|-----trip_point_0_type: critical | ||
|-----trip_point_1_temp: 80 | ||
|-----trip_point_1_type: passive | ||
|-----trip_point_2_temp: 70 | ||
|-----trip_point_2_type: active[0] | ||
|-----trip_point_3_temp: 60 | ||
|-----trip_point_3_type: active[1] | ||
|-----cdev0: --->/sys/class/thermal/cooling_device0 | ||
|-----cdev0_trip_point: 1 /* cdev0 can be used for passive */ | ||
|-----cdev1: --->/sys/class/thermal/cooling_device3 | ||
|-----cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ | ||
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|cooling_device0: | ||
|-----type: Processor | ||
|-----max_state: 8 | ||
|-----cur_state: 0 | ||
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|cooling_device3: | ||
|-----type: Fan | ||
|-----max_state: 2 | ||
|-----cur_state: 0 |
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# | ||
# Generic thermal sysfs drivers configuration | ||
# | ||
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menuconfig THERMAL | ||
bool "Generic Thermal sysfs driver" | ||
default y | ||
help | ||
Generic Thermal Sysfs driver offers a generic mechanism for | ||
thermal management. Usually it's made up of one or more thermal | ||
zone and cooling device. | ||
each thermal zone contains its own temperature, trip points, | ||
cooling devices. | ||
All platforms with ACPI thermal support can use this driver. | ||
If you want this support, you should say Y here |
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# | ||
# Makefile for sensor chip drivers. | ||
# | ||
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obj-$(CONFIG_THERMAL) += thermal.o |
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