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SOLDERPAD HARDWARE LICENSE version 0.51 | ||
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This license is based closely on the Apache License Version 2.0, but is not | ||
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As this license is not currently OSI or FSF approved, the Licensor permits any | ||
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TERMS AND CONDITIONS FOR USE, REPRODUCTION, AND DISTRIBUTION | ||
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#!/bin/bash | ||
# Copyright (c) 2018 ETH Zurich, University of Bologna | ||
# All rights reserved. | ||
# Copyright (c) 2014-2018 ETH Zurich, University of Bologna | ||
# | ||
# This code is under development and not yet released to the public. | ||
# Until it is released, the code is under the copyright of ETH Zurich and | ||
# the University of Bologna, and may contain confidential and/or unpublished | ||
# work. Any reuse/redistribution is strictly forbidden without written | ||
# permission from ETH Zurich. | ||
# Copyright and related rights are licensed under the Solderpad Hardware | ||
# License, Version 0.51 (the "License"); you may not use this file except in | ||
# compliance with the License. You may obtain a copy of the License at | ||
# http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law | ||
# or agreed to in writing, software, hardware and materials distributed under | ||
# this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR | ||
# CONDITIONS OF ANY KIND, either express or implied. See the License for the | ||
# specific language governing permissions and limitations under the License. | ||
# | ||
# Fabian Schuiki <[email protected]> | ||
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#!/bin/bash | ||
# Copyright (c) 2018 ETH Zurich, University of Bologna | ||
# All rights reserved. | ||
# Copyright (c) 2014-2018 ETH Zurich, University of Bologna | ||
# | ||
# This code is under development and not yet released to the public. | ||
# Until it is released, the code is under the copyright of ETH Zurich and | ||
# the University of Bologna, and may contain confidential and/or unpublished | ||
# work. Any reuse/redistribution is strictly forbidden without written | ||
# permission from ETH Zurich. | ||
# Copyright and related rights are licensed under the Solderpad Hardware | ||
# License, Version 0.51 (the "License"); you may not use this file except in | ||
# compliance with the License. You may obtain a copy of the License at | ||
# http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law | ||
# or agreed to in writing, software, hardware and materials distributed under | ||
# this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR | ||
# CONDITIONS OF ANY KIND, either express or implied. See the License for the | ||
# specific language governing permissions and limitations under the License. | ||
# | ||
# Fabian Schuiki <[email protected]> | ||
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#!/bin/bash | ||
# Copyright (c) 2018 ETH Zurich, University of Bologna | ||
# All rights reserved. | ||
# Copyright (c) 2014-2018 ETH Zurich, University of Bologna | ||
# | ||
# This code is under development and not yet released to the public. | ||
# Until it is released, the code is under the copyright of ETH Zurich and | ||
# the University of Bologna, and may contain confidential and/or unpublished | ||
# work. Any reuse/redistribution is strictly forbidden without written | ||
# permission from ETH Zurich. | ||
# Copyright and related rights are licensed under the Solderpad Hardware | ||
# License, Version 0.51 (the "License"); you may not use this file except in | ||
# compliance with the License. You may obtain a copy of the License at | ||
# http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law | ||
# or agreed to in writing, software, hardware and materials distributed under | ||
# this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR | ||
# CONDITIONS OF ANY KIND, either express or implied. See the License for the | ||
# specific language governing permissions and limitations under the License. | ||
# | ||
# Fabian Schuiki <[email protected]> | ||
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# Copyright (c) 2018 ETH Zurich, University of Bologna | ||
# All rights reserved. | ||
# Copyright (c) 2014-2018 ETH Zurich, University of Bologna | ||
# | ||
# This code is under development and not yet released to the public. | ||
# Until it is released, the code is under the copyright of ETH Zurich and | ||
# the University of Bologna, and may contain confidential and/or unpublished | ||
# work. Any reuse/redistribution is strictly forbidden without written | ||
# permission from ETH Zurich. | ||
# Copyright and related rights are licensed under the Solderpad Hardware | ||
# License, Version 0.51 (the "License"); you may not use this file except in | ||
# compliance with the License. You may obtain a copy of the License at | ||
# http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law | ||
# or agreed to in writing, software, hardware and materials distributed under | ||
# this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR | ||
# CONDITIONS OF ANY KIND, either express or implied. See the License for the | ||
# specific language governing permissions and limitations under the License. | ||
# | ||
# Fabian Schuiki <[email protected]> | ||
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// Copyright (c) 2018 ETH Zurich, University of Bologna | ||
// All rights reserved. | ||
// Copyright (c) 2014-2018 ETH Zurich, University of Bologna | ||
// | ||
// This code is under development and not yet released to the public. | ||
// Until it is released, the code is under the copyright of ETH Zurich and | ||
// the University of Bologna, and may contain confidential and/or unpublished | ||
// work. Any reuse/redistribution is strictly forbidden without written | ||
// permission from ETH Zurich. | ||
// | ||
// Bug fixes and contributions will eventually be released under the | ||
// SolderPad open hardware license in the context of the PULP platform | ||
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the | ||
// University of Bologna. | ||
// Copyright and related rights are licensed under the Solderpad Hardware | ||
// License, Version 0.51 (the "License"); you may not use this file except in | ||
// compliance with the License. You may obtain a copy of the License at | ||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law | ||
// or agreed to in writing, software, hardware and materials distributed under | ||
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR | ||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the | ||
// specific language governing permissions and limitations under the License. | ||
// | ||
// Fabian Schuiki <[email protected]> | ||
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// Copyright (c) 2018 ETH Zurich, University of Bologna | ||
// All rights reserved. | ||
// Copyright (c) 2014-2018 ETH Zurich, University of Bologna | ||
// | ||
// This code is under development and not yet released to the public. | ||
// Until it is released, the code is under the copyright of ETH Zurich and | ||
// the University of Bologna, and may contain confidential and/or unpublished | ||
// work. Any reuse/redistribution is strictly forbidden without written | ||
// permission from ETH Zurich. | ||
// | ||
// Bug fixes and contributions will eventually be released under the | ||
// SolderPad open hardware license in the context of the PULP platform | ||
// (http://www.pulp-platform.org), under the copyright of ETH Zurich and the | ||
// University of Bologna. | ||
// Copyright and related rights are licensed under the Solderpad Hardware | ||
// License, Version 0.51 (the "License"); you may not use this file except in | ||
// compliance with the License. You may obtain a copy of the License at | ||
// http://solderpad.org/licenses/SHL-0.51. Unless required by applicable law | ||
// or agreed to in writing, software, hardware and materials distributed under | ||
// this License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR | ||
// CONDITIONS OF ANY KIND, either express or implied. See the License for the | ||
// specific language governing permissions and limitations under the License. | ||
// | ||
// Fabian Schuiki <[email protected]> | ||
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